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Layer : 4 layers (??? 6 Layers ,8layers , 10 Layers)
material : FR4, TG170
finished thickness :2.0 mm
copper : 2oz inner layers
copper : 2oz outer layers
surface finish : OSP
Min trace width /sapce : 0.15mm /0. 15 mm
Min hole size : 0.25mm
white silkscreen, green solder mask
double- sides boards
Sunthone Technology Circuit Co.,LTD
